FinanceDalal Street Investment Journal
Paras Defence signs Rs 6,200 crore MoU for semiconductor facility
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Paras Defence's wholly owned subsidiary Paras Semiconductors Private Limited signed an MoU with MPSeDC for a Rs 6,200 crore semiconductor facility.
The greenfield advanced IC packaging OSAT facility will be set up in the Indore-Ujjain region of Madhya Pradesh.
The facility will perform operations including 3D heterogeneous integration, 2.5D/3D advanced packaging, hybrid bonding, and chiplet integration.
The project aims to strengthen India's semiconductor manufacturing ecosystem and domestic capabilities.
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