India debates its chip-making abilities after packaging milestone

Kaynes Semicon shipped India's first commercially packaged multi-chip modules from its Sanand OSAT plant to California's Alpha and Omega Semiconductor.

Micron's memory-packaging plant opened in February 2026 after a $2.75-billion build.

Almost everything inside a packaged chip at Kaynes Semicon is imported: lead frames from Korea/Philippines, bonding wire from Japan/Germany, epoxy moulding compound from Southeast Asia.

CG Semi, a joint venture with Renesas, cleared customer qualification in roughly ten months, faster than the typical twenty months in Southeast Asia.